Hermetic Electronic Packaging

PA&E specializes in the design, precision machining and connector integration for ultra-rugged, light-weight hermetic integrated electronic packaging for use in extreme environments.

Precision Machining of Hermetic Integrated Electronic Packaging

Using technologies such as Kryoflex® polycrystalline ceramic and explosively bonded
 metals, PA&E designs and manufactures integrated hermetic electronic packaging for extreme environments. From deep space to deep below the earth’s surface, integrated electronic packaging from PA&E delivers high levels of reliability and electrical performance under the harshest conditions. 

By pairing Kryoflex with precision laser welding (rather than solder) electronic packages from PA&E won’t be impacted by the two most common causes of hermetic package failure: solder joint fatigue and cracked glass. 

PA&E produces titanium composite packaging for markets such as the military, aerospace industries that need heat conductive designs. The company also manufactures implantable packaging for a range of medical devices using materials with a proven history of implantable viability.