PA&E strives to be the industry’s leading manufacturer of hermetic connectors and electronic packaging for extreme environments. PA&E is focused on being a quality leader and the preferred supplier to world-class enterprises in the defense, space, medical, and commercial industries. To accomplish this goal, PA&E must constantly work toward quality improvement and process enhancement. Its conformance testing capabilities are designed to provide our customers with an extra level of confidence when purchasing PA&E hermetic connectors and integrated packages.
Electrical Testing – per MIL-STD-202, Method, 301 and 302
Hermetic Testing – per MIL-STD-883, Method 1014, Test Condition A
Hermetic Testing: Greater than or equal to 1 x 10E.-9 cc/sec. Helium at 1 atmospheric pressure.
Metallurgical testing includes core and surface hardness, micro-hardness testing, case depth surveys, coating thickness determination, grain size, cleanliness determinations, eutectic melting, and high-temperature oxidation determinations.
Push-Out Strength Testing
Solderability Testing – per MIL-STD-883, Method 2003
Solderability testing determines if original terminal plating is solderable, or, if an originally solderable terminal is still solderable, and has not been degraded by oxidation or contamination.
Thermal Cycle Testing – per MIL-STD-883, Method 1010
Thermal cycle testing uses the application of various and/or changing temperature extremes to cause measurable changes in a material. This testing may be initiated for a variety of reasons, ranging from material identification to measuring performance under varying temperatures, to identifying contaminates.
Thermal Shock Testing – per MIL-STD-883, Method 1011
Thermal shock testing, the most strenuous temperature test, is designed to show how the product will perform as it expands and contracts under extreme conditions. Thermal shock testing creates an environment that will show (in a short period of time) how products stand up against adverse field conditions and over years of change.
This process verifies that the test unit will function in, and withstand, the vibration stresses that can occur during shipping and throughout a product’s life cycle.
X-Ray Fluorescence Testing – per ASTM-B568
The X-Ray Fluorescence (XRF) test method is widely used to measure the elemental composition and plating thickness of materials. Since this method is fast and non-destructive to the sample, it is the method of choice for industrial production for control of materials.