Dual In-Line Packages and Discretes
Dual-Inline Packages (DIPs) and Discretes from Mission are designed to meet the rigorous demands of high-reliability electronic applications, including aerospace, defense, and telecommunications. These hermetically sealed packages offer exceptional protection for critical components, shielding them from moisture, pressure, and extreme environmental conditions. Available in standard .498 and larger DIP formats, as well as a range of discrete configurations, Mission’s packages support both cold weld and resistance weld crystal bases. Built with precision and durability in mind, these packages ensure long-term performance and integrity in mission-critical systems.