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INTEGRATED ELECTRONIC PACKAGING

SOURIAU PA&E specializes in the design, precision machining and integration of ultra-rugged, light-weight hermetic electronic packaging for use in extreme environments.

Precision Machining of Hermetic Electronic Packaging

Integrated Electronic Packaging

Using technologies such as Kryoflex® polycrystalline ceramic and explosively bonded metals, SOURIAU PA&E designs and manufactures hermetic electronic packaging for extreme environments. Whether it's integrating hermetic components that protect satellites deep in space or producing hermetic connectors for oil-drilling tools that bore deep below the earth's surface, electronic packaging from SOURIAU PA&E are designed to deliver high levels of reliability under the harshest conditions.

By pairing Kryoflex® and explosively bonded metal technologies; utilizing precision machining techniques to build hermetic electronic packaging and using precision laser welding rather than solder joints, electronic packages from SOURIAU PA&E won't be impacted by the two most common causes of hermetic package failure: solder joint fatigue and cracked glass.

SOURIAU PA&E produces titanium composite packaging for markets such as the military, aerospace industries and also creates medical implantable packaging using materials with a proven history of implantable viability.

Integrated Electronic Packaging Exploded

Laser Welding Eliminates Solder Joint Fatigue... Forever!

Download the Integrated Packaging Data Sheet (PDF 873 KB)