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SOURIAU PA&E offers vacuum brazing processes to join dissimilar materials such as titanium, alumina, Zirconia, and more.

Bonding Solutions for Electronic Packaging

Vacuum Brazing - Precision CNC Machining of Components

Metal-to-Ceramic Bonding

Bonding of Electronic Packaging

Electronic Packaging Brazing Process

Our experienced staff of material scientists and process engineers can meet the highest demands for quality — through finite control of these critical brazing processes. Our in-house vacuum brazing capabilities allow us to provide our customers with advanced ceramic-to-metal, metal-to-composite and metal-to-metal bonding solutions for use in fabricated components, electronic packaging and assemblies.

Vacuum Brazing is the process of bonding two or more base materials with a liquid filler material at a temperature below the solidus of the base materials being bonded. The liquid filler material must have a liquidus temperature above 450°C and below the solidus temperature of the base materials.

Ceramic-to-Metal Bonding

  • Titanium-to-Zirconia
  • Invar-to-AIN

Metal-to-Composite Bonding

  • Titanium-to-CuMo
  • High thermal conductivity
  • Low density
  • Low CTE
  • Connectors install via LBW
  • Better strength-to-weight ratio than aluminum

Metal-to-Metal Bonding

  • Stainless-to-Stainless
  • Inconel-to-Stainless
  • Cu/SS-to-Cu/Ti