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Expo Held in Conjunction with the Military & Aerospace Electronics Forum
Wenatchee, WA - April 27, 2009 - Avionics systems depend on components that deliver absolute reliability regardless of environmental conditions and that's why many leading avionics manufactures depend on PA&E's hermetic connector, EMI filter and electronic packaging technology. PA&E will be showcasing these products along with its unique engineering and manufacturing expertise to avionics engineers and engineering managers at this year's Avionics USA Expo, held June 1-2 at the San Diego Convention Center. PA&E application engineers will be on hand in booth 406 to answer questions relative to the design and manufacturing of hermetic connectors and packaging and explain PA&E's approach to delivering products that perform reliability in the most demanding environments.
According to show organizers, this year's event is an extension of the successful Avionics Europe Conference and Expo. The U.S. conference content will cover navigation, aircraft modernizations and retrofits, air traffic control upgrades, electronic flight bag design, runway incursion technology avionics for unmanned aerial vehicles, obsolescence challenges, and safety certification for hardware and software. The conference will offer a number of presentations and technical workshops to paid attendees, but the event organizers are also offering free expo hall passes.
For more information about PA&E, or to learn more about the company's interconnect products, EMI filters, integrated electronic packaging and explosive metal bonding capabilities, contact PA&E at 509-664-8000 or visit us at www.pacaero.com.
PA&E, Inc. is an integrated manufacturing company, specializing in technically demanding ceramic and metal components and assemblies, hermetic connectors and advanced micro-electronic hermetic packaging for global leaders in the defense, space, medical and commercial industries. PA&E is ISO 9001:2000/AS9100 Rev B certified and NADCAP compliant.
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